SE529F vs LM361MDC feature comparison

SE529F NXP Semiconductors

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LM361MDC Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP DIE
Package Description DIP, DIE,
Pin Count 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 36 µA 30 µA
Input Offset Voltage-Max 6000 µV 5000 µV
JESD-30 Code R-GDIP-T14 X-XUUC-N
Length 19.535 mm
Neg Supply Voltage Limit-Max -15 V -16 V
Neg Supply Voltage-Nom (Vsup) -10 V -10 V
Number of Functions 1 1
Number of Terminals 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Type TOTEM POLE TOTEM POLE
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage Limit-Max 15 V 16 V
Supply Voltage-Nom (Vsup) 10 V 10 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
Base Number Matches 3 2
Response Time-Nom 14 ns

Compare SE529F with alternatives

Compare LM361MDC with alternatives