SE529F vs SE529F/883B feature comparison

SE529F NXP Semiconductors

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SE529F/883B Philips Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 36 µA
Input Offset Voltage-Max 6000 µV 10000 µV
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Length 19.535 mm
Neg Supply Voltage Limit-Max -15 V -15 V
Neg Supply Voltage-Nom (Vsup) -10 V -10 V
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Type TOTEM POLE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage Limit-Max 15 V 15 V
Supply Voltage-Nom (Vsup) 10 V 10 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 3
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Response Time-Nom 12 ns
Screening Level MIL-STD-883 Class B (Modified)
Terminal Finish Tin/Lead (Sn/Pb)

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