SE529F
vs
SE529F/883B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
36 µA
Input Offset Voltage-Max
6000 µV
10000 µV
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
Length
19.535 mm
Neg Supply Voltage Limit-Max
-15 V
-15 V
Neg Supply Voltage-Nom (Vsup)
-10 V
-10 V
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Type
TOTEM POLE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage Limit-Max
15 V
15 V
Supply Voltage-Nom (Vsup)
10 V
10 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP14,.3
Response Time-Nom
12 ns
Screening Level
MIL-STD-883 Class B (Modified)
Terminal Finish
Tin/Lead (Sn/Pb)
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