LM361MDC vs 5962-8757202CA feature comparison

LM361MDC National Semiconductor Corporation

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5962-8757202CA NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code WAFER DIP
Package Description DIE, DIE OR CHIP CERAMIC, DIP-14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 30 µA 36 µA
Bias Current-Max (IIB) @25C 30 µA
Input Offset Voltage-Max 5000 µV 6000 µV
JESD-30 Code X-XUUC-N R-CDIP-T14
Neg Supply Voltage Limit-Max -16 V -15 V
Neg Supply Voltage-Nom (Vsup) -10 V -10 V
Number of Functions 1 1
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Type TOTEM POLE
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Response Time-Nom 14 ns
Supply Voltage Limit-Max 16 V 15 V
Supply Voltage-Nom (Vsup) 10 V 10 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 2 5
Pin Count 14
JESD-609 Code e0
Number of Terminals 14
Screening Level MIL-STD-883
Terminal Finish TIN LEAD

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