SCC2691AC1A28,512
vs
935026970518
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
LCC
LCC
Package Description
PLASTIC, MS-018, SOT261-2, LCC-28
PLASTIC, MS-018, SOT261-2, LCC-28
Pin Count
28
28
Manufacturer Package Code
SOT261-2
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
3
3
Boundary Scan
NO
NO
Clock Frequency-Max
4 MHz
4 MHz
Communication Protocol
ASYNC, BIT
MIL STD 1553B; MIL STD 1760
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.0046875 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PQCC-J28
S-PQCC-J28
Length
11.505 mm
11.505 mm
Low Power Mode
YES
YES
Number of Serial I/Os
1
1
Number of Terminals
28
28
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Seated Height-Max
4.57 mm
4.57 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.505 mm
11.505 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
Rohs Code
Yes
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
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