SC28L202A1DGG,118
vs
SC16C654BIEC,528
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
BGA
Package Description
TSSOP,
LFBGA,
Pin Count
56
64
Manufacturer Package Code
SOT364-1
SOT686-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Additional Feature
ALSO OPERATES AT 3.3V SUPPLY
ALSO OPERATES AT 2.5V OR 5V SUPPLY
Address Bus Width
7
5
Boundary Scan
NO
NO
Bus Compatibility
68XXX; 80XXX
Clock Frequency-Max
50 MHz
80 MHz
Communication Protocol
ASYNC, BIT
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
Data Transfer Rate-Max
0.375 MBps
0.625 MBps
External Data Bus Width
8
8
JESD-30 Code
R-PDSO-G56
S-PBGA-B64
JESD-609 Code
e4
Length
14 mm
6 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
2
Number of Serial I/Os
2
4
Number of Terminals
56
64
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LFBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.5 mm
Supply Voltage-Max
5.5 V
3.63 V
Supply Voltage-Min
4.5 V
2.97 V
Supply Voltage-Nom
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Width
6.1 mm
6 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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