SC16C2550BIA44,512
vs
SC16C2550BIB48,128
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
LCC
QFP
Package Description
QCCJ, LDCC44,.7SQ
7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48
Pin Count
44
48
Manufacturer Package Code
SOT187-2
SOT313-2
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
NXP
Additional Feature
ALSO OPERATES AT 2.5V SUPPLY
ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width
3
3
Boundary Scan
NO
NO
Clock Frequency-Max
80 MHz
80 MHz
Communication Protocol
ASYNC, BIT
ASYNC, BIT
Data Transfer Rate-Max
5 MBps
5 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PQCC-J44
S-PQFP-G48
JESD-609 Code
e3
e3
Length
16.5862 mm
7 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
3
1
Number of Serial I/Os
2
2
Number of Terminals
44
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LFQFP
Package Equivalence Code
LDCC44,.7SQ
QFP48,.35SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
245
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
1.6 mm
Supply Voltage-Max
3.63 V
3.63 V
Supply Voltage-Min
2.97 V
2.97 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
16.5862 mm
7 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
Factory Lead Time
4 Weeks
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