SC16C2550BIA44,512 vs SC16C2550BIB48,128 feature comparison

SC16C2550BIA44,512 NXP Semiconductors

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SC16C2550BIB48,128 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC QFP
Package Description QCCJ, LDCC44,.7SQ 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48
Pin Count 44 48
Manufacturer Package Code SOT187-2 SOT313-2
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Additional Feature ALSO OPERATES AT 2.5V SUPPLY ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 5 MBps 5 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J44 S-PQFP-G48
JESD-609 Code e3 e3
Length 16.5862 mm 7 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 1
Number of Serial I/Os 2 2
Number of Terminals 44 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Equivalence Code LDCC44,.7SQ QFP48,.35SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.6 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 16.5862 mm 7 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Factory Lead Time 4 Weeks

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Compare SC16C2550BIB48,128 with alternatives