SC16C2550BIB48,128 vs SC16C2550BIA44,518 feature comparison

SC16C2550BIB48,128 NXP Semiconductors

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SC16C2550BIA44,518 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFP LCC
Package Description 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48 QCCJ, LDCC44,.7SQ
Pin Count 48 44
Manufacturer Package Code SOT313-2 SOT187-2
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP NXP
Additional Feature ALSO OPERATES AT 2.5V SUPPLY ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 80 MHz
Communication Protocol ASYNC, BIT SYNC, BYTE
Data Transfer Rate-Max 5 MBps 5 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G48 S-PQCC-J44
JESD-609 Code e3 e3
Length 7 mm 16.5862 mm
Low Power Mode NO NO
Moisture Sensitivity Level 1 3
Number of Serial I/Os 2 2
Number of Terminals 48 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QCCJ
Package Equivalence Code QFP48,.35SQ,20 LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.57 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7 mm 16.5862 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1

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