SB80L188EB8
vs
TS80C186EB20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEL CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
QFP
QFP
Package Description
LFQFP,
QFP,
Pin Count
80
80
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
20
20
Bit Size
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
40 MHz
External Data Bus Width
8
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQFP-G80
R-PQFP-G80
Length
12 mm
20 mm
Low Power Mode
YES
YES
Number of Terminals
80
80
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.66 mm
3.15 mm
Speed
8 MHz
20 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
4.5 V
Supply Voltage-Nom
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
12 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
2
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
Additional Feature
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SB80L188EB8 with alternatives
Compare TS80C186EB20 with alternatives