SB80L188EB8 vs S80C186EB25 feature comparison

SB80L188EB8 Intel Corporation

Buy Now Datasheet

S80C186EB25 Intel Corporation

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description LFQFP, QFP, QFP80,.7X.9,32
Pin Count 80 80
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 16 MHz 50 MHz
External Data Bus Width 8 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 R-PQFP-G80
Length 12 mm 20 mm
Low Power Mode YES YES
Number of Terminals 80 80
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.66 mm 3.15 mm
Speed 8 MHz 25 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 4.5 V
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 12 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Rohs Code No
Factory Lead Time 4 Weeks
JESD-609 Code e0
Package Equivalence Code QFP80,.7X.9,32
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
Supply Current-Max 115 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SB80L188EB8 with alternatives

Compare S80C186EB25 with alternatives