SAB80C515A-N18
vs
P80C52UFPN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SIEMENS A G
NXP SEMICONDUCTORS
Part Package Code
LCC
Package Description
,
DIP,
Pin Count
68
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
NO
Additional Feature
ON CHIP XRAM 1K X 8; BOOLEAN PROCESSOR
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
18 MHz
33 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQCC-J68
R-PDIP-T40
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
7
Number of I/O Lines
56
32
Number of Serial I/Os
1
Number of Terminals
68
40
Number of Timers
3
On Chip Data RAM Width
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
256
Speed
18 MHz
33 MHz
Supply Current-Max
35 mA
30.8 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.25 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
J BEND
THROUGH-HOLE
Terminal Position
QUAD
DUAL
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
1
ECCN Code
3A991.A.2
Length
52 mm
On Chip Program ROM Width
8
ROM (words)
8192
ROM Programmability
MROM
Seated Height-Max
4.7 mm
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare SAB80C515A-N18 with alternatives
Compare P80C52UFPN with alternatives