P80C52UFPN
vs
SAB80C515-M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
INFINEON TECHNOLOGIES AG
Package Description
DIP, DIP40,.6
PLASTIC, MQFP-80
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
8
8
CPU Family
8051
8051
JESD-30 Code
R-PDIP-T40
S-PQFP-G80
JESD-609 Code
e0
e0
Number of Terminals
40
80
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QFP
Package Equivalence Code
DIP40,.6
QFP80,.7SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
FLATPACK
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
256
256
ROM (words)
8192
8192
ROM Programmability
MROM
MROM
Speed
33 MHz
12 MHz
Supply Current-Max
30.8 mA
35 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
QUAD
Base Number Matches
2
2
Part Package Code
QFP
Pin Count
80
Has ADC
YES
Address Bus Width
16
Clock Frequency-Max
12 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
8
Length
14 mm
Number of I/O Lines
56
On Chip Program ROM Width
8
PWM Channels
NO
Seated Height-Max
2.45 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
5 V
Width
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
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