SA58670BS,115 vs MAX9719BEBE-T feature comparison

SA58670BS,115 NXP Semiconductors

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MAX9719BEBE-T Maxim Integrated Products

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MAXIM INTEGRATED PRODUCTS INC
Part Package Code QFN BGA
Package Description 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT917-1, HVQFN-20 VFBGA, BGA16,4X4,20
Pin Count 20 16
Manufacturer Package Code SOT917-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.33.00.01 8542.33.00.01
Bandwidth-Nom 20 kHz 22 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER AUDIO AMPLIFIER
Gain 24 dB
JESD-30 Code S-PQCC-N20 S-PBGA-B16
JESD-609 Code e4 e0
Length 4 mm 2.02 mm
Moisture Sensitivity Level 1 1
Number of Channels 2 2
Number of Functions 1 1
Number of Terminals 20 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 2.1 W 1.4 W
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN VFBGA
Package Equivalence Code LCC20,.16SQ,20 BGA16,4X4,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.67 mm
Supply Current-Max 9 mA 7.5 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.7 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form NO LEAD BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm 2.02 mm
Base Number Matches 1 3
Pbfree Code No
ECCN Code EAR99
Technology BICMOS

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