SA58670BS,115
vs
YDA162-QZ
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
YAMAHA CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT917-1, HVQFN-20
|
QCCN, LCC20,.16SQ,20
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
SOT917-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
20 kHz
|
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
24 dB
|
|
| JESD-30 Code |
S-PQCC-N20
|
S-PQCC-N20
|
| JESD-609 Code |
e4
|
|
| Length |
4 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
2
|
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
2.1 W
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCN
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
LCC20,.16SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Current-Max |
9 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4 mm
|
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
|
|
|
Compare SA58670BS,115 with alternatives
Compare YDA162-QZ with alternatives