SA58670BS,115
vs
MAX9719BEBE+T
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
BGA
|
Package Description |
4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT917-1, HVQFN-20
|
VFBGA, BGA16,4X4,20
|
Pin Count |
20
|
16
|
Manufacturer Package Code |
SOT917-1
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
20 kHz
|
22 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Gain |
24 dB
|
|
JESD-30 Code |
S-PQCC-N20
|
S-PBGA-B16
|
JESD-609 Code |
e4
|
e1
|
Length |
4 mm
|
2.02 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
2.1 W
|
1.4 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
VFBGA
|
Package Equivalence Code |
LCC20,.16SQ,20
|
BGA16,4X4,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
0.67 mm
|
Supply Current-Max |
9 mA
|
7.5 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
2.02 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Technology |
|
BICMOS
|
|
|
|
Compare SA58670BS,115 with alternatives
Compare MAX9719BEBE+T with alternatives