SA58640DK
vs
U2763B-AFN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ATMEL CORP
Part Package Code
SSOP
SOIC
Package Description
LSSOP,
SSOP, SSOP20,.25
Pin Count
20
20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
e0
Length
6.5 mm
6.625 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
Supply Current-Max
6 mA
Supply Voltage-Nom
5 V
2.9 V
Surface Mount
YES
YES
Telecom IC Type
CORDLESS TELEPHONE SUPPORT CIRCUIT
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
4.4 mm
Base Number Matches
3
1
Package Equivalence Code
SSOP20,.25
Technology
BIPOLAR
Compare SA58640DK with alternatives
Compare U2763B-AFN with alternatives