U2763B-AFN vs BU8242F-T1 feature comparison

U2763B-AFN Atmel Corporation

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BU8242F-T1 ROHM Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ATMEL CORP ROHM CO LTD
Part Package Code SOIC SOIC
Package Description SSOP, SSOP20,.25 SOP-20
Pin Count 20 20
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e3/e2
Length 6.625 mm 12.5 mm
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 2.9 V
Surface Mount YES YES
Technology BIPOLAR
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT SUPPORT CIRCUIT
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD TIN/TIN COPPER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.4 mm
Base Number Matches 3 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.01 mm
Time@Peak Reflow Temperature-Max (s) 10

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