S80C188EC13
vs
MC68EC020FG16
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
MOTOROLA INC
Part Package Code
QFP
QFP
Package Description
QFP, QFP100,.7X.9,32
QFP, QFP100,.7X1.0
Pin Count
100
100
Reach Compliance Code
compliant
unknown
Address Bus Width
20
24
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
26 MHz
16.67 MHz
External Data Bus Width
8
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
Length
20 mm
20 mm
Low Power Mode
YES
NO
Number of Terminals
100
100
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
QFP100,.7X.9,32
QFP100,.7X1.0
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.15 mm
3.1 mm
Speed
13 MHz
16.67 MHz
Supply Current-Max
70 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
HCMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
4
2
HTS Code
8542.31.00.01
Additional Feature
DYNAMIC BUS SIZING; 3 PIPELINE STAGES
JESD-609 Code
e0
Number of DMA Channels
Number of External Interrupts
8
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Terminal Finish
Tin/Lead (Sn/Pb)
Compare S80C188EC13 with alternatives
Compare MC68EC020FG16 with alternatives