S71GL064NB0BHW0Z3
vs
SST32HF1622C-70-4E-LFS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
SILICON STORAGE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56
LFBGA, BGA63,8X10,32
Pin Count
56
63
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
PSRAM IS ORGANIZED AS 2M X 16
SRAM IS ORGANIZED AS 128K X 16
JESD-30 Code
R-PBGA-B56
R-PBGA-B63
JESD-609 Code
e1
Length
9 mm
10 mm
Memory Density
67108864 bit
16777216 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
56
63
Number of Words
4194304 words
1048576 words
Number of Words Code
4000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-20 °C
Organization
4MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.1 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL EXTENDED
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
7 mm
8 mm
Base Number Matches
1
2
Access Time-Max
70 ns
Mixed Memory Type
FLASH+SRAM
Package Equivalence Code
BGA63,8X10,32
Standby Current-Max
0.00003 A
Supply Current-Max
0.04 mA
Compare S71GL064NB0BHW0Z3 with alternatives
Compare SST32HF1622C-70-4E-LFS with alternatives