Part Details for S71GL064NB0BHW0Z3 by Spansion
Overview of S71GL064NB0BHW0Z3 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for S71GL064NB0BHW0Z3
S71GL064NB0BHW0Z3 CAD Models
S71GL064NB0BHW0Z3 Part Data Attributes
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S71GL064NB0BHW0Z3
Spansion
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Datasheet
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S71GL064NB0BHW0Z3
Spansion
Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | PSRAM IS ORGANIZED AS 2M X 16 | |
| JESD-30 Code | R-PBGA-B56 | |
| JESD-609 Code | e1 | |
| Length | 9 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 56 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.1 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm |
Alternate Parts for S71GL064NB0BHW0Z3
This table gives cross-reference parts and alternative options found for S71GL064NB0BHW0Z3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S71GL064NB0BHW0Z3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S71GL064NB0BHW0Z2 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | Spansion | S71GL064NB0BHW0Z3 vs S71GL064NB0BHW0Z2 |
| S71GL064NB0BFW0Z0 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71GL064NB0BHW0Z3 vs S71GL064NB0BFW0Z0 |
| S71GL064NB0BHW0Z2 | Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | Cypress Semiconductor | S71GL064NB0BHW0Z3 vs S71GL064NB0BHW0Z2 |
| S71GL064NB0BHW0Z0 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 | Spansion | S71GL064NB0BHW0Z3 vs S71GL064NB0BHW0Z0 |
| S71GL064NB0BFW0Z3 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71GL064NB0BHW0Z3 vs S71GL064NB0BFW0Z3 |
| S71GL064NB0BFW0Z2 | Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | Spansion | S71GL064NB0BHW0Z3 vs S71GL064NB0BFW0Z2 |