SST32HF1622C-70-4E-LFS
vs
S71PL032J08BFW0B0
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GREENLIANT SYSTEMS LTD
SPANSION INC
Package Description
,
9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
56
Access Time-Max
65 ns
Additional Feature
SRAM IS ORGANIZED AS 512K X 16
JESD-30 Code
R-PBGA-B56
JESD-609 Code
e1
Length
9 mm
Memory Density
33554432 bit
Memory IC Type
MEMORY CIRCUIT
Memory Width
16
Mixed Memory Type
FLASH+PSRAM
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
56
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
2MX16
Package Body Material
PLASTIC/EPOXY
Package Code
TFBGA
Package Equivalence Code
BGA56,8X8,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL EXTENDED
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
7 mm
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