S34ML02G104BHI003
vs
S34ML02G104BHB000
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
Package Description |
BGA-63
|
11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
25 ns
|
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
NO
|
NO
|
Data Polling |
NO
|
NO
|
Data Retention Time-Min |
10
|
10
|
JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B63
|
Length |
11 mm
|
11 mm
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
2K
|
|
Number of Terminals |
63
|
63
|
Number of Words |
134217728 words
|
134217728 words
|
Number of Words Code |
128000000
|
128000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128MX16
|
128MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA63,10X12,32
|
BGA64,10X12,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Page Size |
1K words
|
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Programming Voltage |
3.3 V
|
3.3 V
|
Qualification Status |
Not Qualified
|
|
Ready/Busy |
YES
|
|
Seated Height-Max |
1 mm
|
1 mm
|
Sector Size |
64K
|
|
Standby Current-Max |
0.00001 A
|
0.00001 A
|
Supply Current-Max |
0.035 mA
|
0.035 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Toggle Bit |
NO
|
|
Type |
SLC NAND TYPE
|
SLC NAND TYPE
|
Width |
9 mm
|
9 mm
|
Base Number Matches |
2
|
2
|
Screening Level |
|
AEC-Q100
|
|
|
|
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