Part Details for S34ML02G104BHB000 by Spansion
Overview of S34ML02G104BHB000 by Spansion
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Part Details for S34ML02G104BHB000
S34ML02G104BHB000 CAD Models
S34ML02G104BHB000 Part Data Attributes
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S34ML02G104BHB000
Spansion
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Datasheet
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S34ML02G104BHB000
Spansion
Flash, 128MX16, PBGA63, 11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SPANSION INC | |
| Package Description | 11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Command User Interface | YES | |
| Common Flash Interface | NO | |
| Data Polling | NO | |
| Data Retention Time-Min | 10 | |
| JESD-30 Code | R-PBGA-B63 | |
| Length | 11 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 63 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA64,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3.3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Type | SLC NAND TYPE | |
| Width | 9 mm |