S29GL064N11FFIV10
vs
S29GL064N11FFAV13
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
compliant
compliant
Access Time-Max
110 ns
110 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM/TOP
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
JESD-609 Code
e1
Length
13 mm
13 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Sectors/Size
128
Number of Terminals
64
64
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Page Size
8/16 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1.4 mm
1.4 mm
Sector Size
64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
11 mm
11 mm
Base Number Matches
3
1
Package Description
LBGA,
ECCN Code
EAR99
HTS Code
8542.32.00.51
Date Of Intro
2017-05-26
Compare S29GL064N11FFIV10 with alternatives
Compare S29GL064N11FFAV13 with alternatives