S29GL064N11FFAV13 vs S29GL064A11FAIR23 feature comparison

S29GL064N11FFAV13 Cypress Semiconductor

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S29GL064A11FAIR23 Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description LBGA, 13 X 11 MM, FBGA-64
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2017-05-26
Access Time-Max 110 ns 110 ns
Alternate Memory Width 8 8
Boot Block BOTTOM/TOP BOTTOM
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 13 mm 13 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Screening Level AEC-Q100
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm 11 mm
Base Number Matches 1 3
Rohs Code No
Part Package Code BGA
Pin Count 64
Additional Feature ALSO CONFIGURABLE 8M X 8
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Sectors/Size 128
Package Equivalence Code BGA64,8X8,40
Page Size 4/8 words
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.06 mA
Terminal Finish TIN LEAD
Toggle Bit YES

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