RC28F128J3F75A
vs
PC28F128J3F75D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
BGA-64
Pin Count
64
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Micron
Access Time-Max
75 ns
75 ns
Alternate Memory Width
8
8
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
R-PBGA-B64
S-PBGA-B64
JESD-609 Code
e0
Length
13 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
Number of Sectors/Size
128
128
Number of Terminals
64
64
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Equivalence Code
BGA64,8X8,40
BGA64,8X8,40
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Page Size
4/8 words
4/8 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
235
260
Programming Voltage
2.7 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.2 mm
Sector Size
128K
128K
Standby Current-Max
0.00012 A
0.00012 A
Supply Current-Max
0.08 mA
0.08 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Toggle Bit
NO
NO
Type
NOR TYPE
NOR TYPE
Width
10 mm
Base Number Matches
1
1
Compare RC28F128J3F75A with alternatives
Compare PC28F128J3F75D with alternatives