PC28F128J3F75D
vs
RC28F128J3F75B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
75 ns
75 ns
Alternate Memory Width
8
8
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
S-PBGA-B64
R-PBGA-B64
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Sectors/Size
128
128
Number of Terminals
64
64
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Equivalence Code
BGA64,8X8,40
BGA64,8X8,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Page Size
4/8 words
4/8 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Sector Size
128K
128K
Standby Current-Max
0.00012 A
0.00012 A
Supply Current-Max
0.08 mA
0.08 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Toggle Bit
NO
NO
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Package Description
BGA-64
Pin Count
64
JESD-609 Code
e0
Length
13 mm
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Programming Voltage
2.7 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Terminal Finish
Tin/Lead (Sn63Pb37)
Width
10 mm
Compare PC28F128J3F75D with alternatives
Compare RC28F128J3F75B with alternatives