R1Q3A3618ABG-60R vs GS8161E36DD-150 feature comparison

R1Q3A3618ABG-60R Renesas Electronics Corporation

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GS8161E36DD-150 GSI Technology

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS TECHNOLOGY CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165 LBGA,
Pin Count 165 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1
Length 17 mm 15 mm
Memory Density 37748736 bit 18874368 bit
Memory IC Type QDR SRAM CACHE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 524288 words
Number of Words Code 2000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX18 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial SERIAL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V 2.7 V
Supply Voltage-Min (Vsup) 1.7 V 2.3 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 13 mm
Base Number Matches 1 8
Rohs Code No
Access Time-Max 7.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare GS8161E36DD-150 with alternatives