GS8161E36DD-150 vs R1Q3A3636ABG-33R feature comparison

GS8161E36DD-150 GSI Technology

Buy Now Datasheet

R1Q3A3636ABG-33R Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY RENESAS TECHNOLOGY CORP
Part Package Code BGA BGA
Package Description LBGA, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165
Pin Count 165 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 17 mm
Memory Density 18874368 bit 37748736 bit
Memory IC Type CACHE SRAM QDR SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.46 mm
Supply Voltage-Max (Vsup) 2.7 V 1.9 V
Supply Voltage-Min (Vsup) 2.3 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm 15 mm
Base Number Matches 1 1
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

Compare GS8161E36DD-150 with alternatives

Compare R1Q3A3636ABG-33R with alternatives