PI74SSTU32864NB
vs
PI74SSTU32864NBE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PERICOM SEMICONDUCTOR CORP
PERICOM SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA96,6X16,32
LFBGA, BGA96,6X16,32
Pin Count
96
96
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Family
SSTU
SSTU
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e0
e1
Length
13.5 mm
13.5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
3
3
Number of Bits
25
25
Number of Functions
1
1
Number of Terminals
96
96
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA96,6X16,32
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
2.35 ns
2.35 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
5.5 mm
fmax-Min
270 MHz
270 MHz
Base Number Matches
2
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare PI74SSTU32864NB with alternatives
Compare PI74SSTU32864NBE with alternatives