PI74SSTU32864NB
vs
ICSSSTUA32S865AH-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PERICOM SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA96,6X16,32
TFBGA, BGA160,12X18,25
Pin Count
96
160
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Family
SSTU
SSTU
JESD-30 Code
R-PBGA-B96
R-PBGA-B160
JESD-609 Code
e0
e0
Length
13.5 mm
13 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
3
Number of Bits
25
28
Number of Functions
1
1
Number of Terminals
96
160
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Equivalence Code
BGA96,6X16,32
BGA160,12X18,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Propagation Delay (tpd)
2.35 ns
1.9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
9 mm
fmax-Min
270 MHz
410 MHz
Base Number Matches
1
1
Pbfree Code
Output Characteristics
OPEN-DRAIN
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