PI74SSTU32864ANB vs 74SSTUBF32865ABKG feature comparison

PI74SSTU32864ANB Pericom Semiconductor Corporation

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74SSTUBF32865ABKG Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer PERICOM SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA CABGA
Package Description LFBGA, BGA96,6X16,32 LFBGA-160
Pin Count 96 160
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU 32865
JESD-30 Code R-PBGA-B96 R-PBGA-B160
JESD-609 Code e0 e1
Length 13.5 mm 13 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3 3
Number of Bits 25 28
Number of Functions 1 1
Number of Terminals 96 160
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 2.15 ns 1.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.3 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 9 mm
fmax-Min 270 MHz 410 MHz
Base Number Matches 1 2
Pbfree Code Yes
Manufacturer Package Code BKG160
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260

Compare PI74SSTU32864ANB with alternatives

Compare 74SSTUBF32865ABKG with alternatives