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PI74SSTU32864ANB vs SSTUA32S865ET/G,55 feature comparison

PI74SSTU32864ANB Pericom Semiconductor Corporation

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SSTUA32S865ET/G,55 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PERICOM SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description LFBGA, BGA96,6X16,32 TFBGA, BGA160,12X18,25
Pin Count 96 160
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B160
JESD-609 Code e0
Length 13.5 mm 13 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3 2
Number of Bits 25 28
Number of Functions 1 1
Number of Terminals 96 160
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA96,6X16,32 BGA160,12X18,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Propagation Delay (tpd) 2.15 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 9 mm
fmax-Min 270 MHz 450 MHz
Base Number Matches 1 1
Manufacturer Package Code SOT-802-1
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Logic » FF/Latches
Logic » FF/Latches

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