74SSTUBF32865ABKG vs SSTUM32866EC/S feature comparison

74SSTUBF32865ABKG Integrated Device Technology Inc

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SSTUM32866EC/S NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code CABGA BGA
Package Description LFBGA-160 LFBGA,
Pin Count 160 96
Manufacturer Package Code BKG160 SOT536-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family 32865 32866
JESD-30 Code R-PBGA-B160 R-PBGA-B96
JESD-609 Code e1
Length 13 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3 2
Number of Bits 28 25
Number of Functions 1 1
Number of Terminals 160 96
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 1.5 ns 1.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.3 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 9 mm 5.5 mm
fmax-Min 410 MHz 550 MHz
Base Number Matches 2 1
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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