PDM41532SA20TATY vs HY62UF16100CSLF-I-70 feature comparison

PDM41532SA20TATY IXYS Corporation

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HY62UF16100CSLF-I-70 SK Hynix Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IXYS CORP SK HYNIX INC
Part Package Code TSOP2 BGA
Package Description TSOP2, TFBGA,
Pin Count 44 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.B EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 70 ns
JESD-30 Code R-PDSO-G44 R-PBGA-B48
Length 18.41 mm 6.3 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm 6.2 mm
Base Number Matches 1 1
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

Compare PDM41532SA20TATY with alternatives

Compare HY62UF16100CSLF-I-70 with alternatives