PCI4515AGHK
vs
PCI6612GHK
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-257
LFBGA,
Pin Count
257
216
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bus Compatibility
PCI
PCI
Clock Frequency-Max
24.576 MHz
24.576 MHz
Data Transfer Rate-Max
132 MBps
132 MBps
Drive Interface Standard
IEEE1394; IEEE1394A
IEEE1394; IEEE1394A
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B257
S-PBGA-B216
JESD-609 Code
e0
Length
16 mm
16 mm
Moisture Sensitivity Level
3
Number of Terminals
257
216
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
16 mm
16 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCMCIA
BUS CONTROLLER, PCMCIA
Base Number Matches
2
1
Compare PCI4515AGHK with alternatives
Compare PCI6612GHK with alternatives