PC745BMZFU300LD
vs
IBM25PPC740L-GB300A2T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
,
21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
Pin Count
255
255
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B255
S-CBGA-B255
Low Power Mode
YES
YES
Number of Terminals
255
255
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
300 MHz
300 MHz
Supply Voltage-Max
2.1 V
Supply Voltage-Min
1.9 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
1
Rohs Code
No
Length
21 mm
Package Equivalence Code
BGA255,16X16,50
Seated Height-Max
3 mm
Terminal Pitch
1.27 mm
Width
21 mm
Compare PC745BMZFU300LD with alternatives
Compare IBM25PPC740L-GB300A2T with alternatives