PC745BMZFU300LD vs IBM25PPC740L-GB300A2T feature comparison

PC745BMZFU300LD Thales Group

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IBM25PPC740L-GB300A2T IBM

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS IBM MICROELECTRONICS
Part Package Code BGA BGA
Package Description , 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
Pin Count 255 255
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B255 S-CBGA-B255
Low Power Mode YES YES
Number of Terminals 255 255
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 300 MHz 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 1
Rohs Code No
Length 21 mm
Package Equivalence Code BGA255,16X16,50
Seated Height-Max 3 mm
Terminal Pitch 1.27 mm
Width 21 mm

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Compare IBM25PPC740L-GB300A2T with alternatives