PC745BVZFU300LE
vs
PC745VGHU300LE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA255,16X16,50
BGA, BGA255,16X16,50
Pin Count
255
255
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B255
S-CBGA-B255
JESD-609 Code
e0
Length
21 mm
21 mm
Low Power Mode
YES
YES
Number of Terminals
255
255
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA255,16X16,50
BGA255,16X16,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8 mm
3.08 mm
Speed
300 MHz
300 MHz
Supply Voltage-Max
2.1 V
2.1 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
21 mm
21 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Additional Feature
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Operating Temperature-Max
110 °C
Operating Temperature-Min
-40 °C
Temperature Grade
INDUSTRIAL
Compare PC745BVZFU300LE with alternatives
Compare PC745VGHU300LE with alternatives