PC28F128J3F75H
vs
PC28F128J3F75D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
TBGA,
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Alternate Memory Width
8
8
JESD-30 Code
R-PBGA-B64
S-PBGA-B64
JESD-609 Code
e1
Length
13 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
Number of Terminals
64
64
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
10 mm
Base Number Matches
1
1
Access Time-Max
75 ns
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
Number of Sectors/Size
128
Package Equivalence Code
BGA64,8X8,40
Page Size
4/8 words
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Sector Size
128K
Standby Current-Max
0.00012 A
Supply Current-Max
0.08 mA
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
NO
Compare PC28F128J3F75H with alternatives
Compare PC28F128J3F75D with alternatives