PALCE22V10H-20E4/BLA
vs
GAL22V10C-20LD/883C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
Package Description
DIP, DIP24,.3
CERAMIC, DIP-24
Pin Count
24
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
IT ALSO AVAILABLE IN GDIP-24 PACKAGE
Architecture
PAL-TYPE
Clock Frequency-Max
33.3 MHz
31.2 MHz
JESD-30 Code
R-CDIP-T24
R-CDIP-T24
JESD-609 Code
e0
Length
31.9405 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
20 ns
20 ns
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
1
Compare PALCE22V10H-20E4/BLA with alternatives
Compare GAL22V10C-20LD/883C with alternatives