PALCE22V10H-20E4/BLA vs GAL22V10-20LJI feature comparison

PALCE22V10H-20E4/BLA AMD

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GAL22V10-20LJI Lattice Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC LATTICE SEMICONDUCTOR CORP
Part Package Code DIP QLCC
Package Description DIP, DIP24,.3 PLASTIC, LCC-28
Pin Count 24 28
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET 10 MACROCELLS; 1 EXTERNAL CLOCK; REGISTER PRELOAD; SHARED INPUT/CLOCK
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 33.3 MHz 41.6 MHz
JESD-30 Code R-CDIP-T24 S-PQCC-J28
JESD-609 Code e0 e0
Length 31.9405 mm 11.5062 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Inputs 22 22
Number of Outputs 10 10
Number of Product Terms 132 132
Number of Terminals 24 28
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP24,.3 LDCC28,.5SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Programmable Logic Type EE PLD EE PLD
Propagation Delay 20 ns 20 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 4.57 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 11.5062 mm
Base Number Matches 2 3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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