PAL16R6BCN
vs
F16RP6BFMQB
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
VANTIS CORP
FAIRCHILD SEMICONDUCTOR CORP
Package Description
DIP-20
DFP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
Clock Frequency-Max
37 MHz
40 MHz
JESD-30 Code
R-PDIP-T20
R-CDFP-F20
JESD-609 Code
e0
Number of Inputs
10
Number of Outputs
6
Number of Product Terms
64
Number of Terminals
20
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Function
REGISTERED
MIXED
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
15 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Part Package Code
DFP
Pin Count
20
ECCN Code
3A001.A.2.C
Additional Feature
INDIVIDUALLY PROGRAMMABLE OUTPUT POLARITY
Number of Dedicated Inputs
8
Number of I/O Lines
2
Organization
8 DEDICATED INPUTS, 2 I/O
Seated Height-Max
2.337 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Width
6.9215 mm
Compare F16RP6BFMQB with alternatives