PAL16R6BCN vs F16RP6BFMQB feature comparison

PAL16R6BCN Vantis Corporation

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F16RP6BFMQB Fairchild Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer VANTIS CORP FAIRCHILD SEMICONDUCTOR CORP
Package Description DIP-20 DFP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE
Clock Frequency-Max 37 MHz 40 MHz
JESD-30 Code R-PDIP-T20 R-CDFP-F20
JESD-609 Code e0
Number of Inputs 10
Number of Outputs 6
Number of Product Terms 64
Number of Terminals 20 20
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Function REGISTERED MIXED
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Programmable Logic Type OT PLD OT PLD
Propagation Delay 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DFP
Pin Count 20
ECCN Code 3A001.A.2.C
Additional Feature INDIVIDUALLY PROGRAMMABLE OUTPUT POLARITY
Number of Dedicated Inputs 8
Number of I/O Lines 2
Organization 8 DEDICATED INPUTS, 2 I/O
Seated Height-Max 2.337 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Width 6.9215 mm

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