PA28F400BX-80
vs
HN62434F-20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
HITACHI LTD
Part Package Code
SOIC
SOIC
Package Description
0.525 X 1.110 INCH, PLASTIC, SOP-44
SSOP,
Pin Count
44
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Access Time-Max
80 ns
200 ns
Alternate Memory Width
8
16
Boot Block
BOTTOM/TOP
JESD-30 Code
R-PDSO-G44
R-PDSO-G48
Length
28.2 mm
20 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
MASK ROM
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
262144 words
524288 words
Number of Words Code
256000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256K16
512KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.62 mm
3 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
13.3 mm
14 mm
Base Number Matches
1
2
Compare PA28F400BX-80 with alternatives
Compare HN62434F-20 with alternatives