P89V51RD2FN,112 vs P89C51RC2HBP/00 feature comparison

P89V51RD2FN,112 NXP Semiconductors

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P89C51RC2HBP/00 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description 0.600 INCH, PLASTIC, MO-015, DIP-40 DIP,
Pin Count 40 40
Manufacturer Package Code SOT129-1
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051
Clock Frequency-Max 40 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Length 52 mm 52 mm
Moisture Sensitivity Level 1
Number of I/O Lines 32 32
Number of Terminals 40 40
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 1024
ROM (words) 65536
ROM Programmability FLASH FLASH
Seated Height-Max 4.7 mm 4.7 mm
Speed 40 MHz 33 MHz
Supply Current-Max 50 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Category CO2 Kg 11.6
Compliance Temperature Grade Commercial: +0C to +70C

Compare P89V51RD2FN,112 with alternatives

Compare P89C51RC2HBP/00 with alternatives