P89V51RD2FN,112
vs
P89C51RC2HBP/00
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
0.600 INCH, PLASTIC, MO-015, DIP-40
DIP,
Pin Count
40
40
Manufacturer Package Code
SOT129-1
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Has ADC
NO
NO
Address Bus Width
16
16
Bit Size
8
8
CPU Family
8051
Clock Frequency-Max
40 MHz
33 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
Length
52 mm
52 mm
Moisture Sensitivity Level
1
Number of I/O Lines
32
32
Number of Terminals
40
40
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1024
ROM (words)
65536
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.7 mm
4.7 mm
Speed
40 MHz
33 MHz
Supply Current-Max
50 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Category CO2 Kg
11.6
Compliance Temperature Grade
Commercial: +0C to +70C
Compare P89V51RD2FN,112 with alternatives
P89V51RD2FN,112 vs P89C51RD2BN/01
P89V51RD2FN,112 vs P89V51RD2BN
P89V51RD2FN,112 vs P89C51RD2BN
P89V51RD2FN,112 vs P89V51RD2FN
P89V51RD2FN,112 vs P89V51RC2FN
P89V51RD2FN,112 vs P89C51RD2HBP
P89V51RD2FN,112 vs P89C51RC2BN/01
P89V51RD2FN,112 vs P89C51RD2BN/01,112
P89V51RD2FN,112 vs P89C51RC2BN/01,112
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