P89C51RC2HBP/00
vs
P89V51RD2FN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
0.600 INCH, PLASTIC, MO-015, DIP-40
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
16
16
Bit Size
8
8
Clock Frequency-Max
33 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
Length
52 mm
52 mm
Number of I/O Lines
32
32
Number of Terminals
40
40
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.7 mm
4.7 mm
Speed
33 MHz
40 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Rohs Code
Samacsys Manufacturer
NXP
CPU Family
8051
Moisture Sensitivity Level
1
On Chip Program ROM Width
8
Package Equivalence Code
DIP40,.6
RAM (bytes)
1024
ROM (words)
65536
Supply Current-Max
50 mA
Compare P89C51RC2HBP/00 with alternatives
Compare P89V51RD2FN with alternatives