P89V51RD2FN,112
vs
P89C51RC2BN/01
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
0.600 INCH, PLASTIC, MO-015, DIP-40
DIP, DIP40,.6
Pin Count
40
Manufacturer Package Code
SOT129-1
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Has ADC
NO
Address Bus Width
16
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
40 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
8
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
Length
52 mm
Moisture Sensitivity Level
1
Number of I/O Lines
32
Number of Terminals
40
40
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1024
512
ROM (words)
65536
32768
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.7 mm
Speed
40 MHz
33 MHz
Supply Current-Max
50 mA
40.2 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
1
2
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn)
Compare P89V51RD2FN,112 with alternatives
P89V51RD2FN,112 vs P89V51RD2FN
P89V51RD2FN,112 vs P89V51RD2BN
P89V51RD2FN,112 vs P89C51RD2BN/01
P89V51RD2FN,112 vs P89V51RD2BN,112
P89V51RD2FN,112 vs P89V51RC2FN,112
P89V51RD2FN,112 vs P89V51RC2FN
P89V51RD2FN,112 vs P89C51RC2HFP
P89V51RD2FN,112 vs P89V51RB2FN
P89V51RD2FN,112 vs P89V51RB2FN,112