P89LPC935FA
vs
P89LPC935FDH
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
LCC
|
TSSOP
|
| Package Description |
PLASTIC, MS-018, SOT-261-2, LCC-28
|
4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES BETWEEN 2.4 V AT 12 MHZ
|
ALSO OPERATES BETWEEN 2.4 V AT 12 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| Clock Frequency-Max |
18 MHz
|
18 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G28
|
| JESD-609 Code |
e3
|
e4
|
| Length |
11.505 mm
|
9.7 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of I/O Lines |
26
|
26
|
| Number of Terminals |
28
|
28
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
TSSOP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
TSSOP28,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
768
|
768
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
4.57 mm
|
1.1 mm
|
| Speed |
18 MHz
|
18 MHz
|
| Supply Current-Max |
18 mA
|
18 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
3.3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
11.505 mm
|
4.4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
4
|
|
|
|
Compare P89LPC935FA with alternatives
Compare P89LPC935FDH with alternatives