P89LPC935FDH vs P89LPC935FA,129 feature comparison

P89LPC935FDH Philips Semiconductors

Buy Now Datasheet

P89LPC935FA,129 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 8 8
CPU Family 8051 8051
JESD-30 Code R-PDSO-G28 S-PQCC-J28
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP QCCJ
Package Equivalence Code TSSOP28,.25 LDCC28,.5SQ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 768 768
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Speed 12 MHz 12 MHz
Supply Current-Max 18 mA 23 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING J BEND
Terminal Pitch 0.635 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 2 1
Part Package Code LCC
Package Description PLASTIC, MS-018, SOT-261-2, LCC-28
Pin Count 28
Manufacturer Package Code SOT261-2
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Clock Frequency-Max 12 MHz
DAC Channels YES
DMA Channels NO
External Data Bus Width
JESD-609 Code e3
Length 11.505 mm
Moisture Sensitivity Level 1
Number of I/O Lines 26
On Chip Program ROM Width 8
PWM Channels YES
Seated Height-Max 4.57 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30
Width 11.505 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

Compare P89LPC935FA,129 with alternatives