P89LPC932A1FA,129
vs
P89LPC932A1FHN,151
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
LCC
QFN
Package Description
PLASTIC, MS-018, SOT-261-2, LCC-28
6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-788-1, HVQFN-28
Pin Count
28
28
Manufacturer Package Code
SOT261-2
SOT788-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
CPU Family
8051
Clock Frequency-Max
12 MHz
12 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQCC-J28
S-PQCC-N28
JESD-609 Code
e3
e4
Length
11.505 mm
6 mm
Moisture Sensitivity Level
1
1
Number of I/O Lines
26
26
Number of Terminals
28
28
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
HVQCCN
Package Equivalence Code
LDCC28,.5SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
768
ROM (words)
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.57 mm
1 mm
Speed
12 MHz
12 MHz
Supply Current-Max
18 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
2.4 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
NICKEL PALLADIUM GOLD
Terminal Form
J BEND
NO LEAD
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
11.505 mm
6 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Samacsys Manufacturer
NXP
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Compare P89LPC932A1FHN,151 with alternatives
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P89LPC932A1FHN,151 vs P89LPC932A1FDH,512