P89LPC932A1FHN,151
vs
P89LPC932BA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
QFN
Package Description
6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-788-1, HVQFN-28
QCCJ, LDCC28,.5SQ
Pin Count
28
Manufacturer Package Code
SOT788-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Has ADC
NO
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
12 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-PQCC-N28
S-PQCC-J28
JESD-609 Code
e4
Length
6 mm
Moisture Sensitivity Level
1
3
Number of I/O Lines
26
Number of Terminals
28
28
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
Speed
12 MHz
12 MHz
Supply Voltage-Max
3.6 V
Supply Voltage-Min
2.4 V
Supply Voltage-Nom
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
J BEND
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
6 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
1
2
Rohs Code
CPU Family
8051
Package Equivalence Code
LDCC28,.5SQ
Peak Reflow Temperature (Cel)
245
RAM (bytes)
768
ROM (words)
8192
Supply Current-Max
18 mA
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