P89LPC932A1FHN,151
vs
P89LPC932BA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-788-1, HVQFN-28
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
28
|
|
| Manufacturer Package Code |
SOT788-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Has ADC |
NO
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
12 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N28
|
S-PQCC-J28
|
| JESD-609 Code |
e4
|
|
| Length |
6 mm
|
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of I/O Lines |
26
|
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1 mm
|
|
| Speed |
12 MHz
|
12 MHz
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
2.4 V
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
6 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| CPU Family |
|
8051
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
| Peak Reflow Temperature (Cel) |
|
245
|
| RAM (bytes) |
|
768
|
| ROM (words) |
|
8192
|
| Supply Current-Max |
|
18 mA
|
|
|
|
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