P89LPC9321FA vs P89LPC9321FDH,518 feature comparison

P89LPC9321FA NXP Semiconductors

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P89LPC9321FDH,518 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC TSSOP2
Package Description PLASTIC, MS-018, SOT261-2, LCC-28 4.40 MM, PLASTIC, MO-153, SOT361-1, TSSOP-28
Pin Count 28 28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 18 MHz 18 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQCC-J28 R-PDSO-G28
JESD-609 Code e3 e4
Length 9 mm 9.7 mm
Moisture Sensitivity Level 3 2
Number of I/O Lines 26 26
Number of Terminals 28 28
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ TSSOP
Package Equivalence Code LDCC28,.5SQ TSSOP28,.25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 768 768
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 4.57 mm 1.1 mm
Speed 18 MHz 18 MHz
Supply Current-Max 23 mA 23 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 9 mm 4.4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Manufacturer Package Code SOT361-1
Samacsys Manufacturer NXP

Compare P89LPC9321FA with alternatives

Compare P89LPC9321FDH,518 with alternatives