P89LPC9321FA
vs
P89LPC9321FDH,518
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
LCC
TSSOP2
Package Description
PLASTIC, MS-018, SOT261-2, LCC-28
4.40 MM, PLASTIC, MO-153, SOT361-1, TSSOP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
18 MHz
18 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-PQCC-J28
R-PDSO-G28
JESD-609 Code
e3
e4
Length
9 mm
9.7 mm
Moisture Sensitivity Level
3
2
Number of I/O Lines
26
26
Number of Terminals
28
28
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
TSSOP
Package Equivalence Code
LDCC28,.5SQ
TSSOP28,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
768
768
ROM (words)
8192
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.57 mm
1.1 mm
Speed
18 MHz
18 MHz
Supply Current-Max
23 mA
23 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
NICKEL PALLADIUM GOLD
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
9 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Manufacturer Package Code
SOT361-1
Samacsys Manufacturer
NXP
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